News

Paderborn, Germany, March 2014 – Hesse GmbH, leading manufacturer of high-speed fine pitch wedge bonders and fully automatic heavy wire bonders for the backend semiconductor industry, recently appointed Dr.-Ing. Dirk Siepe as Head of Process Technology and Dipl.-Ing. Mehmet Akcit as Sales Manager for Europe. Dr. Siepe will strengthen Hesse GmbH’s position as a wireRead the full article…

APEC 2014, the Applied Power Electronics Conference and Exposition takes place March 16-20 in Forth Worth, Texas  Fremont, CA, February 2014 – Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH, world leader in wedge wire bonding technology for power, automotive, medical, aerospace, RF, microwave, opto, military and consumer electronics, announces three days of heavyRead the full article…

Hesse Mechatronics Japan Co. Ltd. to open new office    Fremont, CA, February 2014 – Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH, world leader in wedge wire bonding technology for power, automotive, medical, aerospace, RF, microwave, opto, military and consumer electronics, announces that Jiro Hashizume recently joined the company to head up itsRead the full article…

HTMG to support wire bonding equipment sales in RF, automotive and power electronics markets Fremont, CA, January 2014 – Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH, world leader in wedge wire bonding technology for power, automotive, medical, aerospace, RF, microwave, opto, military and consumer electronics, recently announced that it has appointed HTMG asRead the full article…

Fremont, CA, October 2013 – Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH, world leader in wedge wire bonding technology for power, automotive, medical, aerospace, RF, microwave, opto, military and consumer electronics, announces that Hesse GmbH will demonstrate a full range of wedge wire bonding capabilities at Productronica, taking place November 12-15 in Munich,Read the full article…

Lee Levine to present “Wedge Bonding New Wire Alloys for Medical Electronics” Fremont, CA, September 2013 – Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH, world leader in wedge wire bonding technology for power, automotive, medical, aerospace, RF, microwave, opto, military and consumer electronics, will present “Wedge Bonding New Wire Alloys for Medical Electronics”Read the full article…