New Bonder Generation for Heavy Wire – BJ955 & BJ959

Bondjets BJ955 and BJ959 of the new bonder generation are ultrasonic wedge-wedge bonders developed for the fully automated processing of a wide range of large-sized substrates (battery cells), chips and other materials. The new generation is characterized by several new features:

• Optimized pattern recognition
• Software features for the growing demand of connectivity and industry 4.0 (e.g. Hesse Bonder Network, remote control of PR, improved MES integration, …)
• Hesse Assist Tools: load cell, bondtool and wire spool detection, tool calibration without wedge gauge for operator independency