Paderborn, Germany, March 2014 – Hesse GmbH, leading manufacturer of high-speed fine pitch wedge bonders and fully automatic heavy wire bonders for the backend semiconductor industry, recently appointed Dr.-Ing. Dirk Siepe as Head of Process Technology and Dipl.-Ing. Mehmet Akcit as Sales Manager for Europe.

SiepeDr. Siepe will strengthen Hesse GmbH’s position as a wire bonding equipment technology leader. He will lead a team of experts to enable customers to develop and manufacture new products and to improve their wire bonding processes. In addition, Dr. Siepe and his team will work to develop and integrate leading new technology solutions into Hesse GmbH wire bonding equipment.

Dr. Siepe has a decade of experience in wire bonding with industrial and automotive companies. He is a respected expert in wire bonding technology and reliability and introduced the first 400µm copper wire bonding on a chip to the market.

“The profound knowledge of Dr. Siepe for the total wire bonding environment, his deep understanding for technical and also commercial needs and possibilities, in addition to his broad network are a perfect fit for our customers” stated Dr. Hans-Jürgen Hesse, founder and managing director for Hesse GmbH.

AkcitMehmet Akcit will be in charge of strengthening Hesse GmbH´s position in European market.

He has many years of experience in increasingly responsible roles within business development, sales and product management at several global companies. He brings a wealth of sales, marketing and application knowledge with particular expertise in industrial automation, automotive, machine building to his new position.

Hesse Mechatronics, a privately held worldwide company based in Paderborn, Germany, is a leading designer and manufacturer of high speed fine pitch wedge bonders, heavy wire bonders and complementary equipment for semiconductor backend assembly. The company's automatic wedge bonders handle both light and heavy wire applications with aluminum and gold round wire from 12.5 micron (.0005) to 500 microns (.020) in diameter, in addition to ribbon wire from 6 x 35 microns up to .3 x 2 mm, including HCR™(High Current Ribbon); their heavy wire wedge bonder models also handle copper wire and ribbon. The company's product line also includes dispensers, ultrasonic flip chip bonders, standard or customized indexers with or without handling systems, manufacturing process monitoring systems for interfacing with the company's equipment and commercial software packages.

For more information, please visit the company’s website at www.hesse-mechatronics.com.

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