Deep Access Wedge Bonding a Microwave Power Amplifier

The microwave module you have on the video is a building block for a broad band (2-18 Ghz) power amplifier. (~ 8-10 watts) The die that is wire bonded is a GaN TriQuint (now Quorvo) MMIC (Monolithic Microwave Integrated Circuit). The substrate is a 99% alumina ceramic with thin film gold metallization to create a micro-strip structure. The package is a connectorized  metal hermetic package. It is used in commercial test equipment, telecom infrastructure and in military applications.

http://agilemwt.com/products/documents/AMT-A0030.pdf