Fine Pitch Wedge Bonding

This video demonstrates wire bonding loop height and profile repeatability, stitch bonding and fine pitch capability of the Bondjet BJ820.

Wedge bonding capabilities:

  • 1 μm at 3 σ axis repeatability
  • High precision touchdown detection without time delay
  • Precise control of bond force (1 cN)
  • Loop length: 70 µm up to 20 mm
  • Various loop form functions
  • Constant wire length
  • Constant loop height
  • Individual loop shapes
  • Wide range of programmable profiles.
  • Fine Pitch capability  < 40 µm


Bondjet BJ820 High Speed Fully Automatic Fine Wire Wedge Bonder

45 ° / 60° Piezo Bondhead

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