Fine Pitch Wedge Bonding

This video demonstrates wire bonding loop height and profile repeatability, stitch bonding and fine pitch capability of the Bondjet BJ820.

Wedge bonding capabilities:

• 1 μm at 3 σ axis repeatability
• High precision touchdown detection without time delay
• Precise control of bond force (1 cN)
• Loop length: 70 µm up to 20 mm
• Various loop form functions
• Constant wire length
• Constant loop height
• Individual loop shapes
• Wide range of programmable profiles.
• Fine Pitch capability  < 40 µm

RELATED LINKS:

Bondjet BJ820 High Speed Fully Automatic Fine Wire Wedge Bonder

45 ° / 60° Piezo Bondhead