Wire Bonding Z-Height

This video demonstrates room temperature gold wedge bonding with a whopping .350” height difference between the first and second bonds.

The Bondjet BJ820 features:

• 70 µm up to 20 mm loop length
• Various loop form functions
• Constant wire length
• Constant loop height
• Individual loop shapes
• Fine Pitch capability  < 40 µm

RELATED LINKS

Bondjet BJ820 High Speed Fully Automatic Fine Wire Wedge Bonder