News

The BONDJET BJ935 is the only heavy wire bonder to offer 3 mil wire bonding capability Fremont, Calif., Aug 2012 – Hesse Mechatronics Inc., the Americas subsidiary of Hesse GmbH, leading manufacturer of high speed fine pitch wedge bonders and heavy wire bonders for the backend semiconductor industry, will demo a new 3 mil wire bondingRead the full article…

Fremont, Calif., Aug 2012 – Hesse Mechatronics Inc., the Americas subsidiary of Hesse GmbH, leading manufacturer of high speed fine pitch wedge bonders and heavy wire bonders for the backend semiconductor industry, has appointed CWI Technical Sales as its representative along the United States East Coast (states of CT, MA, RI, VT, ME, NH, NY,Read the full article…

Fremont, Calif., Aug 2012 – Hesse Mechatronics Inc., the Americas subsidiary of Hesse GmbH, leading manufacturer of high speed fine pitch wedge bonders and heavy wire bonders for the backend semiconductor industry, has strengthened its customer support and wedge bonder representation throughout Northwestern United States and Canada with the appointment of Prospect Technical Sales thatRead the full article…

  Hesse Mechatronics Inc. Appoints New Technical Training Manager  Fremont, Calif., July 2012 – Hesse Mechatronics Inc., the Americas subsidiary of Hesse GmbH, has appointed Allan Camp as Technical Training Manager. Allan will provide technical training on Hesse’s family of semiconductor packaging equipment including high speed fine pitch wedge bonders and heavy wire bonders. TrainingRead the full article…

  Fremont, CA, May 29, 2012 – Hesse GmbH, European headquarters of Hesse Mechatronics Inc. and sister company to Americas subsidiary Hesse,  will discuss “Wedge Bonding for Chip-On-Board and Direct-Chip-Attach Applications”at the rescheduled SMTA Philadelphia Chapter Meeting now on June 12th at 4:30 p.m. at the Air Products  in Allentown, PA.  The SMTA meeting willRead the full article…

Fremont, CA, May 10, 2012 – Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH, leading manufacturer of high speed fine pitch wedge bonders for the backend semiconductor industry, will discuss “Large Diameter Wedge Bonding of Round and Ribbon Wire for Automotive Applications” during IMAPS 3rd Advanced Technology Workshop and Tabletop Exhibition on Automotive MicroelectronicsRead the full article…