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Fremont, CA, April 25, 2012 – Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH, leading manufacturer of high speed fine pitch wedge bonders for the backend semiconductor industry, will present “Wedge Bonding for Chip-On-Board and Direct-Chip-Attach Applications” at the SMTA Philadelphia Chapter Dinner Meeting on May 9th at 4:30 p.m. Camden, New Jersey. InRead the full article…

Fremont, CA, February 15, 2012 – Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH, leading manufacturer of high speed fine pitch wedge bonders and fully automatic heavy wire bonders for the backend semiconductor industry, recently opened a West Coast Demo and Applications Laboratory to provide enhanced applications and field support to customers throughout theRead the full article…

  Fremont, CA, January 25, 2011 – Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH, leading manufacturer of high speed fine pitch wedge bonders and fully automatic heavy wire bonders for the backend semiconductor industry, will discuss  “Why Wedge Bond?” versus ball bonding in satisfying fine pitch and thin package requirements as one ofRead the full article…

Fremont, CA, January 16, 2012 – Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH, leading manufacturer of high speed fine pitch wedge bonders and fully automatic heavy wire bonders for the backend semiconductor industry, will discuss “Wedge Bonding for RF and Microwave Devices” at the Advanced Technology Workshop and Tabletop Exhibition on RF andRead the full article…

Heavy Wire Bonder Features Support Power Electronics Requirements Fremont, CA, January 6, 2012 – Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH, leading manufacturer of high speed fine pitch wedge bonders and fully automatic heavy wire bonders for the backend semiconductor industry, will demo its next generation BONDJET BJ939 Heavy Wire Bonder at theRead the full article…

Fremont, CA, October 2011 – Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH, leading manufacturer of high speed fine pitch wedge bonders for the backend semiconductor industry, announces that it will present an IMAPS webinar, “Why Wedge Bond,” taking place on November 10, 2011 from 12pm – 1pm. The cost is $25 for IMAPSRead the full article…